供应固晶银胶

| 捷佳半导体贸易(深圳)有限公司 | |
| 联 系 人: | 聂巍先生 |
| 电 话: | 0755-83752995 |
| 移动电话: | 13632870877 |
| 传 真: | 0755-83599326 |
| 地 址: | 广东省深圳市福田保税区红花路1001号国际商贸中心9栋203 |
| 邮 编: | 518000 |
| 公司网站: | http://www.jjbdt.com |
产品说明
DL-6900A Silver Adhesive
Description:
DL-6900A electrically conductive die attach silver adhesive
is designed for high reliability packaging application. It has
following features:
●Excellent dispensability
●Low bleed
●Low condensable volatiles
●Low moisture absorption
●Rapid bond strength
●Superior reliability test performance of the assembled devices.
Product Specification:
Filler Type: Silver
Thermal Conductivity (@20~25℃):>40 Watt / (m?K)
Viscosity@25℃ : 40 k cps (Brookfield CP51@5RPM)
Thixotropic lndex: 4.6 (Viscosity@1rpm/Viscosity@10rpm)
Storage Life@5℃: 6 month
Resistivity (after 150℃/1 hrs Cured): <50 mΩ/sq./mil
Recommended Cure Condition:
30 minutes@175℃ ± 5℃ (Weight loss on cure~6.7%)or
60 minutes@160℃ ± 5℃
Physiochemical Properties (Post Cure):
Weight Loss@260℃ : <0.1%
Glass Transition Temperature (Tg): ~180℃
Coefficient of Thermal Expansion:
Below Tg: 85 ppm/℃
Above Tg: 110 ppm/℃




